Bonding Strength Testing Machine "MFM Series"
CE, RoHS certified device! Bond tester equipped with proprietary technology (patented).
The "MFM Series" is a bonding strength testing machine (bond tester) that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding. It adopts the unique patented technology "VPM (Vertical Position Movement)" to achieve multifunctionality, high performance, high precision, and high reproducibility. It is suitable for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting. 【Features】 ■ VPM TECHNOLOGY (Vertical Point Movement) ■ DGFT (Digital Force Technology) ■ Dynamic Transducer Technology ■ Auto-Range Technology (Fully Automatic Range Technology) ■ Excellent System Rigidity & Control (Equipment Rigidity and Control Software) *For more details, please download the PDF or feel free to contact us.
- Company：オー・エル・エム インターナショナル 本社営業所
- Price：Other
